Bonding Machine
The bonding machine is a device for accurately positioning and bonding IC chips on LCD glass. The whole machine is composed of PLC + HMI control core. The automatic image alignment system PV310 completes the calculation of the alignment data of the target object.
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Dongguan Yongce Electronic Technology Co., Ltd.
Description:
Our company is in Shenzhen. Specializing in the production of led backlight strips and testers. In 2014, researched the LED backlight tester and became the only patentee. The brand registered in the United States is "TKDMR".
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