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Attributes
Customized BGA chip aging test socket BGA324 ball IC adapter test fixture socket 1.0 spacing FPGA
$268.57
Reference Price1individual (Min. Order)
Ship From
Shenzhen, Guangdong
Shipping
To be negotiated with the supplier
Customization
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Key Attributes
Details
Price Disclaimer
Brand
ANDK
Model number
BGA324-1.0 flip probe test seat with heat dissipation block
packaging
boxed
Part status
on sale
Installation Type
Snap in type
Characteristics
MCUBGA324 functional test
material
PEEKBeCuAL
Other integrated circuits
324
Place of Origin
Chinese Mainland
Applicable scenarios
Perform performance testing, aging, and screening tests on BGA chips
encapsulation
BGA packaging
Number of pins
324 pieces
Test seat type
Clamshell
Pin spacing
1.0mm
Chip spacing
1.0
quantity
1
Batch number
Subject to shipment
Details
Price Disclaimer
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