BGA107-1.0 Aging Seat Flip up Manual NAND Flash Reliability Test

Photos

Attributes

BGA107-1.0 Aging Seat Flip up Manual NAND Flash Reliability Test

$97.14

Reference Price

1individual (Min. Order)

online trading

BGA107-1.0 flip aging seat

Negotiable

Ship From

Shenzhen, Guangdong

Shipping

To be negotiated with the supplier

Customization

For customization requests, please

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Customized FPC6pin-0.5 spacing beryllium copper gold-plated spring clip micro needle test clip high-precision connector FPC testing

Brand

HMILU

Model number

BGA107-1.0 flip aging seat

Device Type

socket

Contact electroplating

Gold

Contact material

BerylliumCopper

Location/socket

107PinDIP

Function

aging test

insulating material

PEI

Maximum operating temperature

155

Minimum operating temperature

-45℃

packaging

boxed

quantity

encapsulation

BGA

Batch number

Subject to shipment

Single pin overcurrent capability

Details

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