Tianjin Lianpu Testing Technology Co., Ltd
1yearOS 4

Integrated circuit mold cleaning adhesive compatible with axial packaging SOP DIP structure cleaning adhesive strip

$11.43 / kilogram
Reference Price
1kilogram (Min. Order)
Ship From
Tianjin
Shipping
To be negotiated with the supplier
Customization
For customization requests, please
Sulfurization temperature
175℃
vulcanization time
300 seconds to 350 seconds
Scope of application
Axial packaging 1A-6A, SOP, DIP
Applicable subjects
IC、MCU、 Power devices, storage chips, discrete devices
Product Features
Mold cleaning without disassembly, does not damage the coating of the mold
product form
Available in strip and block shapes
Product color
Available in gray and white
supporting services
Free samples are available and foreign object analysis is provided
customized service
Support customized specifications as needed
Applicable process
Epoxy EMC plastic sealing process
Adaptation scenario
Semiconductor chip packaging production line
core function
Control packaging production costs
Performance characteristics
Temperature and pressure resistance, suitable for plastic sealing conditions
Product Series
Integrated rubber material with clear and smooth mold
Packaging specification
Conventional packaging can be adjusted through negotiation
Details
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