Automatic wafer thermal curing temporary bonding machine ABT-12 facilitates standardized continuous operation of maintenance interfaces

The fully automatic glass coating machine ACO-12 is easy to maintain with a simple structure, standardized interfaces, and replaceable accessories

Automatic Crystal Circle Light Curing Temporary Bonding Machine ABU-08 Constant Temperature Control Closed Chamber Precision

Fully automatic mechanical debonding machine ADM-12 with smooth transmission, good heat dissipation, pressure resistance, temperature resistance, and dust prevention

Xinrui Technology's bonding equipment has sufficient supply and satisfactory results, and is professional and reliable

Fully automatic wafer thermal slip bonding machine ADC-08 with anti-static insulation, low vibration and low noise traceable

Fully automatic round light curing temporary bonding machine ABU-12, sturdy and dense integrated molding modular metal shell

Fully automatic edge cleaning machine AEC-12 dustproof, low shaking, low pollution programmable signal acquisition data recording