Manufacturers can customize UV LED exposure semiconductor chip wafer debonding machine, UV mucosal imported lamp beads

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Manufacturers can customize UV LED exposure semiconductor chip wafer debonding machine, UV mucosal imported lamp beads

$4285.71

Reference Price

1platform (Min. Order)

color

grayish white

Negotiable

Ship From

Suzhou, Jiangsu

Shipping

To be negotiated with the supplier

Customization

For customization requests, please

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Price Disclaimer

Brand

Koinu

Does it support customized processing

Yes

Is it imported

No

Material

sheet metal

Scope of application

3C, Semiconductors, electronics

Scope of application

Exposure, debonding, curing

Device dimensions

950*650*300

Load bearing plate

5Kg

wavelength

365

cooling method

air cooling

UV intensity

70-750MW/CM2

exposure time

Touchscreen Settings

input power

100V~240V

Function adjustment

10%~100%

Optical power (MW/cm ^ 2)

70-75

measuring instrument

EIT standard

Details

Price Disclaimer

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