Integrated equipment for non-destructive and non-destructive cutting of silicon wafers, with multifunctional operation suitable for cutting various materials

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Attributes

Integrated equipment for non-destructive and non-destructive cutting of silicon wafers, with multifunctional operation suitable for cutting various materials

$negotiable / platform

Reference Price

1platform (Min. Order)

Ship From

Suzhou, Jiangsu

Shipping

To be negotiated with the supplier

Customization

For customization requests, please

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Brand

brand name

Number of sets

input voltage

Determine based on specific model

Drive configuration

electric

Model number

Model Name

positioning accuracy

tall

type

Damaged cutting equipment

Is it imported

Principle of action

cutting

Control method

automatic

Scope of application

Industrial cutting

Applicable Material

multiple materials

efficiency

tall

insulation class

Determine based on specific model

Control System

Intelligent

Power

Determine based on specific model

Shell protection level

Determine based on specific usage environment

Cutting accuracy

tall

Details

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